Wafer Packing/Unpacking Equipment

Product offering

20+ Years of Leadership in
200 and 300 mm

• 300mm Wafer packing, unpacking and sorting (200mm Option)
• SEMI S2/S8 Compliant – 3rd party certification
• SEMI SECSGEM300 Host Compliant
• Rorze RR756 robot with compliance, flip module and multi chamber wafer handling end effector
• 2 or 4 – Rorze RV-201 linear or front/rear FOUP/FOSB LP with RFID
• E84 FOUP/FOSB Transfer to RV201 LP
• Single Stocker with 2 – HWS LP and three (3) reservoir drawers for interleaves, ring separators or foam cushions
• Baumer Camera detection of packing media
• Automated HWS lid removal/replacement (EVO2 AUTO Option)
• Automated HWS transfer stage (EVO2 AUTO Option)
• Class 10 Mini Environment
• Throughput: 140 WPH Packing, 125 WPH Unpacking
• Footprint: 4LP - 1309mm D x 2524mm W, 6LP – 1802mm D x 2524mm W)

• Film Frame and/or wafer packing, unpacking and sorting
• SEMI S2/S8 Compliant – 3rd party certification
• Rorze RR757 dual arm robot with interference management with fixed Ti EE for film frame and flip EE for wafer handling
• 2 - modified Rorze RV-201 LP for FOUP, FOSB, or 300mm dicing cassette with RFID
• E84 FOUP/FOSB Transfer to RV201 LP (Optional)
• Dual Stocker configuration with 1 - Wafer HWS LP for wafer and/or FFS LP (per stocker) with RFID
• Sliding Drawer HWS/FFS LP – PGV Accessible
• 3 - Reservoir Drawers for interleave, ring, v-tray and foam cushion handling (per stocker)
• Baumer Camera detection of packing media
• Automated HWS/FFS lid removal/replacement (Optional)
• Class 10 Mini Environment
• Throughput: 140 WPH Pack, 110 WPH Unpack
• Footprint (dual stocker): 2215mm D x 2610mm W

• 1 - Automatic Sliding HWS LP Drawer
• 1 - Deep LP drawer for tall (ring separators) HWS
• Retractable HWS LP drawer front – AGV access
• Light Curtain over HWS LP Drawer
• Auto HWS lid removal/replacement
• E-84 PIO sensors for HWS AGV transfer and FOUP AGV/OHT transfer

• Packing, Unpacking, Sorting
• Semi Carriers :
  • - Open Carriers
  • - Horizontal Finished Wafer Shipper
• 150 mm capability
• Down to 180㎛ (200 mm)
• Modular configuration
• Back-Side Inspection
• SEMI, CE Compliant
• SECSII Communication